T-top81 High Thermal Conductive Gap Filler

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LiPOLY T-top81 offers outstanding thermal conductivity at 8.0 W/m*K and extremely low thermal resistance under minimal force. T-top81 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.


  • Between CPU and heat sink
  • Between a component and heat sink
  • Flat-panel displays
  • Power supplies
  • High speed mass storage drives
  • Telecommunication hardware

Characteristics: Silicone compound with weak sticky surfaces

Configurations: Sheets form, Die-cuts parts