T-top81 High Thermal Conductive Gap Filler
Description
LiPOLY T-top81 offers outstanding thermal conductivity at 8.0 W/m*K and extremely low thermal resistance under minimal force. T-top81 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
TYPICAL APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
Characteristics: Silicone compound with weak sticky surfaces
Configurations: Sheets form, Die-cuts parts