Electronics
In smartphones assembly: Cover Glass and front frame bonding, Back cover and frame bonding, LCM edge bonding for ultra-narrow bezel, Battery cell edge folding and bonding, IMT UV glue
In PCBA/FPCB: Underfill, Encapsulate, Adhesive on components
In camera module: Lens bonding, Barrel fixing, Grounding, Housing bonding Active alignment, Die attach Underfill
In accessories: MMA / 2K / PUR Hotmelt / CA / Magnet bonding, Encapsulate Waterproof, Underfill / Coating
In smart devices: Adhesive, Adhesive Seal, Adhesive for Speaker, EMI Gasket, PUR Hotmelt, Die Attach, Encapsulate
Adhesive map of tablet: Full screen bonding, Structural bonding, LCM light blocking, BMS protection, Thermal management
Showing all 12 results
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3200S Polyurethane Hot Melt Adhesives
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7035E Polyurethane Hot Melt Adhesives
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7038B Polyurethane Hot Melt Adhesives
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9001 Polyurethane Hot Melt Adhesives
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AS200-s Ultra Low Oil-Bleed Thermal Conductive Gel Pad
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N700A Non-Silicone Thermal Conductive Pad
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N700B Non-Silicone Thermal Conductive Pad
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N700C Non-Silicone Thermal Conductive Pad
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T-top81 High Thermal Conductive Gap Filler
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T-work7000 High Thermal Conductive Gap Filler
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Weldbond UF2002 underfill adhesive
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Weldbond UF2101 underfill adhesive
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