Weldbond UF2002 underfill adhesive
Weldbond UF2002 is 2nd level underfill adhesive
Fast flow at room temperature
Weldbond UF2002 is designed to improve the reliability of fine–pitch chip scale package (CSP) and wafer level packaging (WLCSP) assembly, and are suitable for automatic production line of customers.
|Curing Condition||10 min at 130°C|
|Tg by TMA (°C)||60|
|Pot Life (25°C) (day)||3|