Weldbond UF2002 underfill adhesive
Description
Weldbond UF2002 is 2nd level underfill adhesive
Black Liquid
Fast flow at room temperature
No voiding
Reworkable
Excellent reliability
Weldbond UF2002 is designed to improve the reliability of fine–pitch chip scale package (CSP) and wafer level packaging (WLCSP) assembly, and are suitable for automatic production line of customers.
| Product Name | UF2002 |
|---|---|
| Appearance | Black Liquid |
| Viscosity (cPs@25℃) | 300-600 |
| Curing Condition | 10 min at 130°C |
| Elongation (%) | 108.0 |
| Tg by TMA (°C) | 60 |
| CTE1/CTE2 (ppm/℃) | 60/190 |
| Pot Life (25°C) (day) | 3 |
| Storage Temp | -20°C |
