Thermal pad

High Thermal Conductive Gap Filler is an extremely high-performance thermally conductive pad, with excellent insulation, compressibility, and soft characteristics that can fill gaps exhibit a very low thermal resistance effect. They can be customized die-cut and shape molding.

Non-Silicone Thermal Conductive Pad is silicone free resin material. None low-molecular-weight siloxane volatilization cause no electrical contact failure. It is suitable for optical products or sensitive electronic components. Thermal conductivity: 1.5~13 W/m*K. Hardness Shore OO/50-60 has good thermal conductivity and exhibits the lowest thermal resistance value, especially the thermal conductivity of N800C is as high as 13W/m*K.