Weldbond UF2101 underfill adhesive
UF2101 is 1st level underfill adhesive
Fast flow at room temperature
High Tg, low CTE
Weldbond UF2101 is designed to improve the reliability of fine–pitch chip scale package (CSP) and wafer level packaging (WLCSP) assembly, and are suitable for automatic production line of customers.
|Curing Condition||10min at 150°C|
|Tg by TMA (°C)||30|
|Pot Life (25°C)(day)||1|