Weldbond UF2101 underfill adhesive

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UF2101 is 1st level underfill adhesive

Black Liquid
Fast flow at room temperature
Fast curing
High Tg, low CTE

Weldbond UF2101 is designed to improve the reliability of fine–pitch chip scale package (CSP) and wafer level packaging (WLCSP) assembly, and are suitable for automatic production line of customers.

Product Name UF2101
Appearance Black Liquid
Viscosity (cPs@25℃) 8,000-11,000
Curing Condition 10min at 150°C
Elongation(%) 160.0
Tg by TMA (°C) 30
CTE1/CTE2 (ppm/℃) 30/140
Pot Life (25°C)(day) 1
Storage Temp -40°C